8 Layer HDI PCB Board

8 Layer Printed Circuit Board With Blind And Buried Holes

PCB Specifications:

Layer Count: 8 Layer HDI PCB

Board Thickness: 1.2MM

Material: FR4 S1000-2 S1000-2 DATA SHEET.pdf

Min Hole: 0.1MM

Min Line: 3/3 Mil

BGA Size: 8.66Mil

Unit Size: 135MM*104MM/2UP

Blind Holes: L1-L2 , L1-L3, L7-L8, L6-L8 0.1MM

Buried Holes: L2-L3, L3-L6, L6-L7 0.1MM

Via Holes: L1-L8 0.2MM

Solder Mask: Green

Surface Treatment: ENIG

Application: Access Scanning Device

Our Capability:

FAQ:

Question: What is Via Plugging?

Answer: Via plugging is a process in which vias are completely filled with resin or closed with solder mask. This technique is different from via tenting where resin/solder mask doesn’t fill the via hole but just provides a covering.

Via plugging is done as a preventive measure to secure the vias from the unwanted flow of solder material during the assembly/soldering process. During the soldering process, if a via is not plugged or tented, the solder can flow down the via from the pads and can creates unnecessary solder joints.

Via plugging can be done through conductive or non-conductive material. The conductive filled vias help to carry a large amount of current from one side of the PCB board to another. However, the main drawback of conductive filled vias is the difference in CTE (Coefficient of Thermal Expansion) between the conductive fill and surrounding laminate. During PCB operation, the conductive material will heat and expand at faster rate than the surrounding laminate, which can cause a fracture between the via wall and associated contact pad.

The via holes filled with non-conductive materials will still function like normal vias. However they will not be able to carry higher current loads like those filled with conductive materials.

Quesion: What is Via in Pad?

Answer: ‘Via in Pad’ is when the via is placed directly on the pad of a surface mount component. Once this is done, the via is filled with conductive or non-conductive epoxy, followed by capping and electrochemical plating to make it virtually invisible. Such type of arrangement results in buried via within the PCB surface that can be completely soldered as standard SMT lands.

The Via in Pad can be filled using non-conductive epoxy, conductive epoxy, copper, or silver followed by electrochemical plating.