Witgain Technology Ltd
Witgain Technology Ltd Professional PCB Manufacturer
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10 Layer Rigid Printed Circuit Board , PCB Board , TG170 FR4 Material
PCB Specifications:
Layer Count: 10 Layer Rigid PCB
Material: FR4, TG170
Board Thickness: 2.0MM
Min Hole: 0.2MM
Hole Stucture: L1-L10
Min Trace: 4/4Mil
BGA: 12Mil
Aspect Ratio: 10:1
Solder Mas: Green
Surface Treatment: ENIG
Application: Industrial Control
Capabilities:
| Item | Capability |
| Layer Count | 1-24 Layers |
| Board Thickness | 0.1mm-6.0mm |
| Finished Board Max Size | 700mm* 800mm |
| Finished Board Thickness Tolerance | +/-10% +/-0.1(<1.0mm) |
| Warp | <0.7% |
| Major CCL Brand | KB/NanYa/LTEQ/ShengYi/Rogers Etc |
| Material Type | FR4,CEM-1,CEM-3,Aluminum,Copper,Ceramic, PI, PET |
| Drill Hole Diameter | 0.1mm-6.5mm |
| Out Layer Copper Thickness | 1/20Z-8OZ ; |
| Inner Layer Copper Thickness | 1/3OZ-6OZ |
| Aspect Ratio | 10:1 |
| PTH Hole Tolerance | +/-3mil |
| NPTH Hole Tolerance | +/-1mil |
| Copper Thickness Of PTH Wall | >10mil(25um) |
| Line Width And Space | 2/2mil |
| Min Solder Mask Bridge | 2.5mil |
| Solder Mask Alignment Tolerance | +/-2mil |
| Dimension Tolerance | +/-4mil |
| Max Gold Thickness | 200u'(0.2mil) |
| Thermal Shock | 288C, 10s, 3 Times |
| Impedance Contro | +/-10% |
| LTest Capability | PAD Size Min 0.1mm |
| Min BGA | 7mil |
| Surface Treatment | OSP, ENIG, HASL, Plating Gold, Carbon Oil,Peelable |
FAQ:
Question: What is the most difficult part for this ten layer pcb
Answer: The min hole is 0.2mm and board thickness is 2.0mm, which makes the aspect ratio is 10:1. It increases difficulties during PTH process.