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6 Layer Printed Circuit Board , PCB Board , Vin In Pad Treatment , Used In ANC Earphones
6 Layer Printed Circuit Board
PCB Specifications:
Layer Count: 6 Layer Rigid PCB:
Material: FR4
Board Thickness: 1.0MM
Min Hole: 0.2MM
Min Trace: 4/4Mil
BGA Size: 8Mil
Features: Resin Plugged in BGA Hole, Via In Pad
Solder Mask: Green
Surface Treatment: ENIG
Application: ANC Earphone and TWS Earphone
Product Lead Time:
FAQ:
Question: What is via in pad
Answer: For some pcbs, due to the limited space, the via holes need to be designed on BGA pad. In order to meet this design requirement, we need to drill the hole on bga pad first, then PTH the hole and use resin to plug in the hole. From the pad surface, we won't see any holes. So it won't affect SMT function.
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