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4 Layer Half Hole Printed Circuit Board , Finished Thickness 0.8MM , HDI , Blind And Buried Holes
4 Layer Half Hole Printed Circuit Board With Blind And Buried Holes
PCB Specifications:
Layer Count: 4Layer Half Plated Hole PCB
Board Thickness: 0.8MM
Copper Thickness: 1/H/H/1OZ
BGA Size: 10 Mil, Via In Pad
Min Hole: 0.1MM
Min Line: 3/3 Mil
Hole: L1-L4
Blind Hole: L1-L2 0.1MM, L3-L4 0.1MM
Buried Hole: L3-L4 0.2MM
Solder Mask: Green
Surface Treatment: ENIG
Material: FR4
Unit Size: 84*92MM/4*4up
Special Treatment: 4 Side Half Plated Holes
Application: WIFI Module
Capabilities:
Item | Capability |
Layer Count | 1-24 Layers |
Board Thickness | 0.1mm-6.0mm |
Finished Board Max Size | 700mm* 800mm |
Finished Board Thickness Tolerance | +/-10% +/-0.1(<1.0mm) |
Warp | <0.7% |
Major CCL Brand | KB/NanYa/LTEQ/ShengYi/Rogers Etc |
Material Type | FR4,CEM-1,CEM-3,Aluminum,Copper,Ceramic, PI, PET |
Drill Hole Diameter | 0.1mm-6.5mm |
Out Layer Copper Thickness | 1/20Z-8OZ ; |
Inner Layer Copper Thickness | 1/3OZ-6OZ |
Aspect Ratio | 10:1 |
PTH Hole Tolerance | +/-3mil |
NPTH Hole Tolerance | +/-1mil |
Copper Thickness Of PTH Wall | >10mil(25um) |
Line Width And Space | 2/2mil |
Min Solder Mask Bridge | 2.5mil |
Solder Mask Alignment Tolerance | +/-2mil |
Dimension Tolerance | +/-4mil |
Max Gold Thickness | 200u'(0.2mil) |
Thermal Shock | 288C, 10s, 3 Times |
Impedance Contro | +/-10% |
LTest Capability | PAD Size Min 0.1mm |
Min BGA | 7mil |
Surface Treatment | OSP, ENIG, HASL, Plating Gold, Carbon Oil,Peelable |
FAQ:
Question: What is the most common quality issue for this kinf of pcb?
Answer: 1) Copper burr in half holes
2) Oxidation in half holes