Witgain Technology Ltd
Witgain Technology Ltd Professional PCB Manufacturer
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8 Layer HDI Printed Circuit Board , Blind And Buried Holes , 1.0MM , FR4 IT180A Material
8 Layer Printed Circuit Board With Blind And Buried Holes
PCB Specifications:
Layer Count: 4Layer Half Plated Hole PCB
Board Thickness: 1.0MM
Material: FR4 IT180A
Min Hole: 0.1MM
Min Line: 3/3 Mil
BGA Size: 8Mil
Unit Size: 122*114MM/12UP
Blind Holes: L1-L2 , L7-L8 0.1MM
Buried Holes: L2-L3 , L6-L7 0.1MM , L3-L6 0.2MM
Via Holes: L1-L8 0.8MM
Min Distance Between Inner Layer Line to Holes: 6Mil
Solder Mask: Green
Surface Treatment: ENIG+OSP(OSP for BGA Pads)
Special Treatment: Half Plated Holes
Application: GPS Module
Other PCB Show:
FAQ:
Question: What is the most common quality issue for this kinf of pcb?
Answer: 1) Copper burr in half holes
2) Oxidation in half holes
Question: Why use surface treatment ENIG+OSP?
Answer: OSP has good tin solder paste feature . The BGA size is only 8mil. If use immersion gold, it's not good for tin solder paste. So we suggest customer to use ENIG+OSP. It can protect other pads well and meanwhile, it makes sure that the BGA pads have good tin solder paste feature.
Question: Is the cost for ENIG+OSP higher than ENIG?
Answer: Yes it is. But it won't make a big difference.