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8Layer HDI PCB, FR4, ENIG, BLACK SOLDER MASK , Blind And Buried Holes
8 Layer HDI PCB
PCB Specifications:
Layer Count: 8Layer HDI PCB
Board Thickness: 1.0MM
Material: FR4 High TG
Min Hole: 0.1MM
Min Line: 3/3 Mil
Hole: L1-L2, L2-L3, L3-L4, L4-L5, L5-L6, L6-L7, L7-L8, L1-L8
Solder Mask: Black
Surface Treatment: ENIG
Application: Consumer Electronics
Product Structure(Layer Count Distribution):
FAQ:
Question: How many lamination times for this 8 layer pcb?
Answer: There are in total 3 times lamination for this pcb.
Question: How many drilling times for this pcb?
Answer: There are in total 5 times drilling for this pcb.
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