Witgain Technology Ltd
Witgain Technology Ltd Professional PCB Manufacturer
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4 Layer Printed Circuit Board With Blind And Buried Holes , Half Hole PCB , OSP+ENIG
4 Layer Printed Circuit Board With Blind And Buried Holes
PCB Specifications:
Layer Count: 4Layer Half Plated Hole PCB
Board Thickness: 1.0MM
Material: FR4
Copper Thickness: 1/H/H/1OZ
Min Hole: 0.1MM
Min Line: 3/3 Mil
BGA Size: 8Mil
Unit Size: 82*109.6MM/20UP
Hole: L1-L4, L2-L3, L3-L4, L1-L2
Min Distance Between Inner Layer Line to Holes: 5Mil
Solder Mask: Green
Surface Treatment: ENIG+OSP(OSP for BGA Pads)
Special Treatment: Half Plated Holes
Application: GPS Module
Capabilities:
| Item | Capability |
| Layer Count | 1-24 Layers |
| Board Thickness | 0.1mm-6.0mm |
| Finished Board Max Size | 700mm* 800mm |
| Finished Board Thickness Tolerance | +/-10% +/-0.1(<1.0mm) |
| Warp | <0.7% |
| Major CCL Brand | KB/NanYa/LTEQ/ShengYi/Rogers Etc |
| Material Type | FR4,CEM-1,CEM-3,Aluminum,Copper,Ceramic, PI, PET |
| Drill Hole Diameter | 0.1mm-6.5mm |
| Out Layer Copper Thickness | 1/20Z-8OZ ; |
| Inner Layer Copper Thickness | 1/3OZ-6OZ |
| Aspect Ratio | 10:1 |
| PTH Hole Tolerance | +/-3mil |
| NPTH Hole Tolerance | +/-1mil |
| Copper Thickness Of PTH Wall | >10mil(25um) |
| Line Width And Space | 2/2mil |
| Min Solder Mask Bridge | 2.5mil |
| Solder Mask Alignment Tolerance | +/-2mil |
| Dimension Tolerance | +/-4mil |
| Max Gold Thickness | 200u'(0.2mil) |
| Thermal Shock | 288C, 10s, 3 Times |
| Impedance Contro | +/-10% |
| LTest Capability | PAD Size Min 0.1mm |
| Min BGA | 7mil |
| Surface Treatment | OSP, ENIG, HASL, Plating Gold, Carbon Oil,Peelable |
FAQ:
Question: What is the most common quality issue for this kinf of pcb?
Answer: 1) Copper burr in half holes
2) Oxidation in half holes
Question: Why use surface treatment ENIG+OSP?
Answer: OSP has good tin solder paste feature . The BGA size is only 8mil. If use immersion gold, it's not good for tin solder paste. So we suggest customer to use ENIG+OSP. It can protect other pads well and meanwhile, it makes sure that the BGA pads have good tin solder paste feature.
Question: Is the cost for ENIG+OSP higher than ENIG?
Answer: Yes it is. But it won't make a big difference.